Welcome to visit the official website of Shenzhen Keshijia Electronics Co., Ltd!

WeChatWeChatFeedback

Keshijia Electronics

Shenzhen Keshijia Electronics Co., Ltd!

Pursuing quality and excellence

Keshijia Electronics

Hotline:0755-23002529

Back Current:Home >Support >Process capability

Plate type FR-4, halogen-free FR4, high Tg board, aluminum board, copper board, high frequency board
Plate thickness 0.20mm ~ 3.5mm
Maximum size 650mm × 520mm 
Number of layers 1 ~20Layer
Minimum line width / spacing 0.075/0.075mm
Characteristic impedance Tolerance±10%
Maximum copper thickness of outer layer 6OZ (0.21mm)
Minimum aperture  0.15mm
Borehole diameter 0.15mm ~6.5mm 
Width of solder bridge 0.10mm
Aperture ratio 10 :1 
Surface treatment Tin spraying, chemical gold precipitation, tin precipitation, silver precipitation, OSP, gold plating
Solder mask color White, green, yellow, red, black, blue, etc
Standard delivery date Double sided model 3-4 days, four layer model 4-6 days